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Reflow Soldering-Resistant Solid-State 3D Micro-Supercapacitors Based on Ionogel Electrolyte for Powering the Internet of Things

Abstract : The fabrication of all solid-state 3D micro-supercapacitor is challenging for powering connected and miniaturized emerging electronics devices in the frame of the future Internet of Things paradigm. Here we highlight the design of a specific solid electrolyte based on ethylmethylimidazolium bis(trifluoromethanesulfonate)imide confined within polyvinylidenefluoride which enables to meet the requirements of safety, easy packaging, and leakage free 3D micro-supercapacitors. This ionogel-based microdevice (2 mm × 2 mm footprint area) exhibits good cycling stability over 30 000 cycles with an areal energy density of 4.4 μWh.cm−2 and a power density of 3.8 mW.cm−2. It can also sustain the high temperature reflow soldering process (∼250 °C–5 min) without damage, which is performed to directly bond surface mounted miniaturized devices onto printed circuit boards. This strategy not only provides a reference for the design of high-performance 3D interdigitated micro-supercapacitors, but also paves the way to their further implementation in miniaturized electronic chips for Internet of Things applications.
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https://hal.archives-ouvertes.fr/hal-03115423
Contributor : Richard BASCHERA Connect in order to contact the contributor
Submitted on : Friday, May 20, 2022 - 2:33:59 PM
Last modification on : Monday, July 4, 2022 - 9:48:23 AM

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B. Asbani, Botayna Bounor, K. Robert, C. Douard, L. Athouël, et al.. Reflow Soldering-Resistant Solid-State 3D Micro-Supercapacitors Based on Ionogel Electrolyte for Powering the Internet of Things. Journal of The Electrochemical Society, Electrochemical Society, 2020, 167 (10), pp.100551. ⟨10.1149/1945-7111/ab9ccc⟩. ⟨hal-03115423⟩

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